Monday 28th July 2014,
0x10c Portal – Jump Right In!™ 0×10 ͨ

Custom Coding Ideas & Examples for the DCPU

admin November 16, 2012 No Comments


A big shout out to Steve for this awesome guest post. Steve emailed us a few weeks ago and asked if he could contribute to 0x10cPortal and we’d like to thank him for the time and effort he has taken to pull this together. Well done Steve!

Introduction

Before reading this, carefully look over the “Board Builder” image below. This displays a fictional program which is used to construct various virtual electronic boards that are then finalized and generated into useable, inerconnectable, 3D in-game objects. This document was written to host ideas, examples and how this process could work in theory.

Notes

-Document is semifictional; fiction and non-fiction.

-Not intended to be the core of a game but a supplemental semifictional
system which attempts to add available discovery within a new community.

-Not written or presented to be implemented; It was simply developed and expanded to correlate, map and structure the concept/idea(s).

-Not intended as a proof of concept; Intended to display and/or map reasonable dependence between the theoretical components and/or parts.

-System does not rely on customization of componentry; Relys on the customization of how componentry is arranged within a board. (how many can be effectivly jammed into one board)

-Regardless of placement, (in-game or standalone) the “builder program” would require common file/program controls such as : File — Edit — View ——– Tools — Window — Help

-Builder program : General ability to save layouts for later editing/re-load aids in loss; Online community database. Anyone can sell a board they designed or give it away. Purchasers can rate your boards. High rated designers displayed as engineers (Avg. rating/ rating/ Proficent component class: D;C;B or A/ Trusted/ Registered/ Offical/ ?/ ?/

-ICs and chipsets are the largest category within this builder system, class could indicate pin mapping and signal combo, while the level indicates – level of initial speed and/or factory over-clocking
Cmpny. name / IC Type / Class-D,C,B,A ; Signals in-for-Signals out | Level-1 ; Factory OC
E.g: -S.E.D.I-Navigation IC ( Class-D ; 2:1 | Level-1 ; 0% )

-Additionally the builder was invisioned to calculate the price before or during the generation/finalization process. Hypothetically speaking : “Anyone could go online, grab a free layout, open, generate then pay and have it in-game. If a free layout incorporates expensive componentry exceeding available funds the board can not be uploaded, to be in-game.”

-Components have long lifespans 6-12months, heat degrades lifespan, scrap boards are usually very cheap and vary in tech levels for similar prices but will show an average estimated lifespan remaining. If components are hovered over they will show individual estimated lifespan remaining.

-ICs/Chipsets are not customizable; Some (very limited) ICs have “variable” but pre-determined functions. e.g. An overclocker IC; The value is adjusted with a potentiometer.

-ICs Chipsets and practically all other components are only customizable in placement with the parts given/stated; their specifications, uses, mappings ect. are all predetermined by : A Developer/Developers/Real-world self-enrolled companys?

-Everything discussed is purely hypothetical or a theory; Pictures are to provide Some sort of visual representation.

-These are ideas and not real or implemented in anyway to any game..

-System names, uses, dependencies ect. are not realistic in all aspects.

-Capacitors, resistors and diodes only serve to acheive (at minimum) the maximum lifespan of the componentry they are connected to; Components pin(s) information displays icons for what to use where. (the stated use is of course fictional but a base of the given system)

-The information pertaining to capacitors, resistors and diodes is reduced to the essential purpose; This is just information though, their actual use again (within this system) is simply to enable, at minimum, the maximum stated lifespan of the component it is connected to.

NEED TO DO:
Determining dependence between modules/devices, and how they correlate with ICs/Chipsets
ICs, classes system types (use) mapping tree.

Board Builder (click to enlarge)

Table of Contents – Electrical Components and Board Construction Theory

  • Imbedded Wire
  • Pass-Through Points
  • Integerated Circuits (IC)
  • NBRIDGE Integrated Circuits
  • SBRIDGE Integrated Circuits
  • Chipsets
  • Memory (RAM)
  • SECURi Chips
  • Cards and Card-Readers
  • Capacitors
  • Diodes
  • Resistors
  • Variable Resistors (Potentiometers)
  • Fuses
  • Circuit Breakers
  • Input Jacks
  • Output Jacks
  • Vertical Input Jacks
  • Vertical Output Jacks
  • Audio Jacks
  • Power Mains (+) & (-)
  • Cross-Overs
  • Hard disks and inter-connects (ports)
  • Signal Activity Lights
  • Placeable Wires
  • Electronic component Failures and Repairs
  • Builder Specifications and Reasons
  • Sub-topic of section 23; Theory on board Finalization (3D Generation)
  • Electrical Boards, Types and Sizes
  • System Types
  • System Devices
  • Integration to the Ship
  • Power
  • Devices (Device List)
  • Sensors (Sensor List)
  • Racks and board covers
  • Fastening (screws)

=====================================================================

Imbedded Wire

Imbedded wire is the under-lying conductive material used to make pathways around electrical boards for the intercommunication between different onboard electrical components.

As you place Imbedded wire it will either:
(a.) Shows a grid for the next available pixel to continue the path.
(b.) Shows nothing because the method of pathway construction is known.
(c.) Allows an option in the builder program to toggle grid view.
Creates path step by 1px In all directions. (Dectection Range)

Additionally each pixel of pathway used, reduces (subtracts from) the overall speed of the IC it is connected to by (0.01hz) (x needs calculating, refer to Chapter on ICs)

Pass-Through Points

Pass-through-points are used to move imbedded wire pathways from the top to the bottom of a Dual Layer electrical board for more efficient or advanced designs. PTPs are used frequently in order to avoid unnecessary use of crossovers. Three types work the same; No cost difference and they do not fail:

  • Normal,
  • Mini
  • …and Micro sizes.
  • Smaller versions help with design implications. Larger versions are easier to handle.

Example of connection area:

As your place PTPs in the builder (only on dual-layer boards) they automatically align themselves. Think of the two layers as covers for a book. Punch a hole through the book. When opened flat and looking at the two covers the holes are mirrored. This would also effect imbedded wire (on the bottom board) so some sort of masking/tracking tool may help. When building it requires a name when placed on the board (created) with mouse hoverable tooltips for tracking. e.g. [ (-) power feed for IC_lifesupportsystems ] Editable.

Integerated Circuits (IC)

ICs perform many vital electrical functions and can be controlled by Chipsets of which are controlled by the main DCPU computer. Chipsets and ICs are dependant on one another in more advanced systems. Basic functions can be acheived when using variable or fixed ICs by themselves. chipsets contain the coding and functions to run multiple ICs from their single (+) (-) CPU mix output. ICs can handle the same CPU signal as chipsets and can be initialized via coding (or) functions but only the single function(s) they perform. Essentially ICs by themselves can only be initialized with the appropriate functions or coding for their operation.

This means you have to know each of the functions to run each system. Chipsets can reslove and automate this but are somewhat difficult to engineer into a personally designed system. Less desirable ICs require two signals for calculating a single useable output while many devices require two. This means on occasion a second IC must be used to obtain the remaining necessary data or another, more favorable IC is purchased.

Different ICs have different specifications:

  • ICs Independant Speed Mhz or Hz (Reduced by Imbedded wire subtraction formula)
  • ICs Mhz or Hz load on the main CPU. (Chipsets can buffer this slightly)
  • Size, number of pins and pin mapping.
  • CPU load refers to the maximum amount of allocatable CPU usage before the system becomes unstable.
  • Fixed ICs and classes are strictly manufactured by cutting-edge laboratories. (Not user controllable)
  • Every IC has some CPU requirement (CPU load) except for NBRIDGE ICs.
  • All ICs require (+) (-) power and an Input CPU signal.
  • Other input/output combos on ICs vary by system/use.
  • Some are better due to more favorable features or pin mappings.
  • They have their own speeds (e.g. 300mhz or Hz range)
  • IC Speed (300mhz) is reduced by (.20?) for each pixel of Embedded Wire Pathway connected to it.
  • It may be difficult to track which pathways are connected to which ICs and handle them seperatly.
  • May be better to have the Builder program total collective IC’s and pertaining speeds and then subtract the reductive effect of the Imbedded Pathways used in the build.
  • Some cheaper ICs can run independently but require more manual data entry.

IC construction:

  • More advanced builder for ICs. Built magnified with a specific layout process that includes specific parts designed for IC construction.
  • Imbedded wire is still used to form some circuitry within the IC for the desired result.
  • When finalized the IC is converted into a useable board component (small sprite).
  • The larger circuitry desgned that is now shrunk into a small useable component retains its circuitry data. ICs inner circuitry could consist of special code acceptive parts that can be programmed. Editable control and testing of parameters such as temperature, pressure, difference, ect.

NBRIDGE Integrated Circuits

NBRIDGE ICs provide multiple (+) (-) CPU signals from a single (+) (-) CPU Signal. They are typically used for multiple IC control but can also be used with Chipsets.

  • Supply multiple CPU signal outputs from one CPU input signal.
  • Can reduce speed loss due to increased use of Imbedded Wire.
  • Do not reduce speed like imbedded wire unless they have unused outputs. (-5mhz speed outgoing 5x5px=25×0.20=5mhz 25px is the 5 by 5 dark grey square. The speed lost is the size of the NBRIDGE IC minus its gold contacts)
  • Do not provide any buffer to the CPU like some Chipsets.
  • Like ICs and Chipsets, Provide Markings to locate the right side.
  • Can be rotated in the builder.
  • Can be used behind itself for more signals.

SBRIDGE Integrated Circuits

SBRIDGE ICs provide multiple Hard disk (+) (-) signals from a single (+) (-) Hard disk signal. They can also be used in reverse to combine multiple hard disk signals into a single (+) (-) signal. Additionally they can be used both ways within card reader circuits for data access from both the chipset and hard disks across an array of other boards/systems if desired.

They are typically used to span hard disk access across a number of systems.

  • Do not reduce speed like imbedded wire.
  • Like ICs and Chipsets, Provide Markings to locate the right side.
  • Can be rotated in the builder.

Chipsets

Chipsets carry the essential librarys of codes, events or functions that are used to run the various systems of your ship. Chipsets are initialized by the DCPU via code functions similar to ICs but can have buffers, can automate and can control multiple ICs by themselves.

In addition, they can simplify control because they can turn one command into mutiple commands. The picture above demonstrates a basic chipset, other larger and more expensive chipsets could provide system diagnostics and in some cases tracking as to where a system failure is occuring between multiple systems which for example aids in finding burnt or exhausted componetry. Although they provide increasingly considerable benifits, they create notable amounts of heat.

  • Some chipsets feature a small buffer to decrease load from the main CPU.(DCPU)
  • All Chipsets require (+) (-) power, in & out CPU signals, some amount of on-board memory, (+) (-) Signal In DCPU (for commands), (+) (-) MIX outputs for multi-IC control and (+) (-) Input from a HardDisk.
  • Chipsets cannot run ICs unless they have the proper coding/functions to do so.
  • Can be back-hacked from ICs that are connected and transmitting data, allowing access to internal chipset functions.
  • Buffer refers to a small CPU inside the chipset that can support Load from ICs it is controlling.
  • If Excess bandwidth remains it reduces the total load on the main CPU by the remainder (very small but adds up).
  • Can be rotated in the builder.
  • Small mountable fans possibly connected to 3 pin power outputs on a board that are fed from the boards main power source (on-board connector for a fan to cool larger chipsets or 1 of the three pins routes to a small on-board fan control IC)
  • Some are better due to more favorable features or pin mappings.
  • Chipsets require commands in order to execute actions.
  • Most systems must run in the background or continuously.
  • Some systems can be run in the background or not.
  • Background or continuous operations require one initialization or BOOT until power is lost or the operation is stopped.
  • ICs require a string for location.
  • Superceded by use of chipsets.
  • Loaded with own liabrarys
  • Without chipset : llCommand(string board, string integrated circuit, run = TRUE or FALSE);
  • if a chipset is used to control an IC :
    With chipset : llCommand(string board, string chipset, integer index of functions, run = TRUE or FALSE);
    Functions are described in the contents of the chipset, if a function is run from a chipset it automtically affects the appropriate IC.

Starting/Stopping Operations :

  • Manually
  • Automatically
  • Sub-system or componentry failure
  • Virus program
  • Frequency based hacking from another entity (player, NPC)

Information!

default
{
//this event would handle incoming signals from buttons or controllers
linked_sys_ message(integer sender_num, integer num, string msg, key id)
{
if(msg == “set destination”)
{
supercieded with
//DCPU Function string IC string chipset Chipset Function
llCommand(“NavigationIC_100″, “chipset_Nav”, “llNavigator”);
}
}
}

Memory (RAM)

All Chipsets require some amount of Memory for operation. Memory is not effect by the use of imbedded wire like other componentry and only varys in speed (& Timings). (Mhz or Hz Range)

  • Timings (e.g. 4-4-3T or something… Lower = Faster)
  • No reduction from Imbedded Wire connecting it to the Chipset.
  • O & I Markings designate Input and Output (+) (-) sets.
  • Connection mapping to Chipsets :
  • O = Memory IN on Chipset
  • I = Memory OUT on Chipset

SECURi Chips

These chips are placed between the chipset and ICs that handle any incoming and outgoing wireless transmissions keeping anyone or anything from accessing chipset functions. Some models have higher levels of encryption and are thus more effective at deflecting attacks through frequency communication.

Cards and Card-Readers

(Floppy > Data Card)

  • Floppy for programs, scripts, hacks etc
  • Data card for personal documents, journal, photos etc

Capacitors

  • Capacitors are used to provide stable consistant voltages to ICs and other componentry.
  • Connected to, from top to bottom.
  • If they are not used subsequent components will not last their full life-time.
  • Components state hardware requirements in with the pin mapping information.
  • Micro versions function the same and last longer but are more expensive.

One or the other :

  • Only 2 types with components determining where they are required for longest life.
  • Extensive types to cover a range of volatges and all would probably require tooltips when hovering so you know what the specifications are, once its on the board.

Diodes

Diodes are required to keep currents traveling a specific direction. (both are pointing down)

  • Connected to, from top to bottom.
  • White arrow or white-side determines direction of travel.
  • Components state hardware requirements in with the pin mapping information.
  • Micro versions function the same and last longer but are more expensive.

One or the other :

  • Only 2 types with components determining where they are required.
  • Extensive types would probably require tooltips when hovering so you know what the specifications are, once its on the board.

Resistors

Resistors keep voltages within a certian range and are another factor of componentry life.

  • Connected to, from top to bottom.
  • Components state requirements in with the pin mapping information.
  • Can fail/burn-out.
  • Micro versions function the same and last longer but are more expensive.

One or the other :

  • Only 2 types with components determining where they are required.
  • Multiple types with the two current types possibly splitting 50-20k (20k-10k values for the larger; 10k-0.10 values for micros)

Variable Resistors (Potentiometers)

Potentiometers are used with variable ICs to set a value to a desired amount.

  • When clicked they open a ( X closeable) mini HUD where the dial can be rotated affecting a displayed value.
  • Could be used to adjust the shutoff temperature of a variable IC that is essentially the same as the coffee maker IC.
  • This could be used to brew coffee at ones own desired temperature.
  • Larger models for dials

Fuses

Fuses protect electrical components from over-amperage. Connected top to bottom, the fuse lays in two small cup recepticles (Darker rim raised from lighter center with the fuse fitting inside the two).

  • Fuses protect power feeds. (red and black mains)
  • Fuse boards can simply be built. (A board that handles multiple power feeds)
  • Custom board sizes up to 128px 256px Boards can be at max 128px wide, or any size under. This way you can trim this board length wise to make more of a bar.

Example of connecton map:

Presently only Chipsets, ICs and Sensors recieve power, thus they can be protected with one main power fuse. One or the other :

  • Fuses simply protect against improper connections or rare energy spikes. (for example, frequency based attacks accessing a chipset and purposely overloading an energy system.) If a maximum is reached , the fuse breaks and must be removed and replaced but the system is saved. (one type)
  • Fuses have specified types with basic color bands for identification or a mouse hoverable tooltip.

Input Jacks

Input Jacks (Horizontial versions) handle incoming signals (IN) to the boards IC and chipset componentry. Presently three types:

  • I indicates “INPUT”
  • Vertical variants (slightly larger but very useful for inner board connections)
  • Gray handles incoming IC related signals.
  • Blue handles incoming CPU load signals to the chipset or ICs.
  • Brown handles incoming DCPU signal Commands (Chipsets only, if just an IC is connected to a blue input from the CPU, it can still be initialized by the DCPU)
  • Basic Chipsets only require input for DCPU commands. (output for diagnostics)
  • Can be flipped and rotated in the builder because you may need the red and black connection points inverted at times.

Output Jacks

Output Jacks (Horizontial versions) handle outgoing signals (OUT) from the boards IC and chipset componentry. Presently three types:

  • O indicates “OUTPUT”
  • Used for outside of board
  • Vertical variants (slightly larger but very useful for inner board connections)
  • Gray handles outgoing IC related signals to devices.
  • Blue handles outgoing CPU load signals to the chipset or ICs.
  • Brown handles outgoing DCPU signal Commands. This is specific to chipsets; if a single IC is connected to a blue input from the ‘CPU Load’ signal, it can still be initialized by the DCPU.
  • Basic chipsets only require input for DCPU commands.
  • Can be flipped and rotated in the builder because you may need the red and black connection points inverted at times.

Vertical Input Jacks

Input Jacks (Vertical versions) handle incoming signals (IN) to the boards IC and chipset componentry. Presently three types:

  • Inner black markings indicate “INPUT”
  • Used for inner board connections.
  • Horizontial variants. (smaller but limited to outer mounting)
  • Gray handles incoming IC related signals.
  • Blue handles incoming CPU load signals to the chipset or ICs.
  • Brown handles incoming DCPU signal Commands (Chipsets only, if just an IC is connected to a blue input from the CPU, it can still be initialized by the DCPU)
  • Basic Chipsets only require input for DCPU commands. (output for diagnostics)
  • Can be flipped and rotated in the builder because you may need the red and black connection points inverted at times.

Vertical Output Jacks

Output Jacks (Vertical versions) handle outgoing signals (OUT) from the boards IC and chipset componentry. Presently three types:

  • Outer black markings indicate “OUTPUT”
  • Used for inner board connections.
  • Horizontial variants (smaller but limited to outer mounting)
  • Gray handles outgoing IC related signals.
  • Blue handles outgoing CPU load signals to the chipset or ICs.
  • Brown handles outgoing DCPU signal Commands (chipsets only)
  • Basic Chipsets only require input for DCPU commands. (output for diagnostics)
  • Can be flipped and rotated in the builder because you may need the red and black connection points inverted at times.

Audio Jacks

Possibly On larger more advanced systems having audio interfaces for music, virtual ship avatar ect. Could be wrapped into larger more complex chipsets that then require a simple audio based integrated circuit (IC) to run. (Not implemented at present time but easy)

Horizontial Power Mains (+) & (-)

Horizontial Power mains supply power to your ICs and chipsets. Power can be split numerous ways from Imbedded wire to Pass-Thru-Points.
Example: (Power feed sprites not updated)

  • Each Negative Power Feed must have one Diode NOTE: The arragement on the picture above.
  • Polaritys to components must be correct.
  • Pin mappings will show polarity.

Vertical Power Mains (+) & (-)

Vertical Power mains supply power to your ICs and chipsets just like their H-mount counterparts but can be located on the inner workings of the board. Power can be split numerous ways from Imbedded wire to Pass-Thru-Points.

  • Each Negative Power Feed must have one Diode
  • Work the same as horizontially mounted mains but are not limited to the outer border of the board.
  • Polaritys to components must be correct.

Cross-Overs

Cross-overs allow Imbedded Wire pathways to intersect without connecting but sleep any passing signals by (0.2 seconds) Used only when they must.

  • Grey ends or tips connect top, left, right and diagonally.
  • Red and Black colors do not indicate required polaritys. They simply display the cross-over.

Hard disks and inter-connects (ports)

All chipsets require some intercommunication between the hard disk. Hard disks only require the pair of (+) (-) TO/FROM hard disk pins from the chipset. Further dual-way intercommunication is split by the ports themselves for readng and writing data (fictional). Expansions are easy. Hard disks support limited data, and while this is very small can add up, sometimes a cheaper alternative to purchasing a larger much more expensive enclosure.

  • Requires seperate power supply with its own cord
  • Different sizes – 10-80Mb (not literally 80mb of data, but simulated)
  • Some are faster
  • SSD models (too advanced!)

Signal Activity Lights

Signal activity lights function to indicate specific on-board signal activity. They require in-line connection to the positive pole of any signal pathway (shown above).

  • Or require both (+) (-) (Passes signal; monitors signal)
  • Do not have any reductive effect.
  • Horse-shoe and in-line variations.
  • Light blinks to indicate signal activity.

Placeable Wires

Placeble wires work to interconnect boards to the main CPU, DCPU, power sources and all other incoming and outgoing connections between sensors or devices. Not sprite based or even 3D if possible. Possibly using a drawing system that places it into the 3D atmosphere. Similar to pipe dreams but with a point other than that of saving a physical screen.

Example of some accepted interconnects:

  • Input and Output combo wires automatically correct to their proper polaritys.
  • Same for vertical variants.

Rough example of placeable wire and appropriate options:

Electronic Component Failures and Repairs

Component failures while rare will occur. Older systems are subsequentlly prone to more frequent component failure. After maximum life (X= lifetime; should be pretty long) the component rolls a low chance to fail resulting in a undeterminable extension of lifespan after exceeding the specified maximum.

Componentry Lifespan :

  • 6 months – 2 years (actual time)
  • Components past max. lifespan begin their chance roll to fail (low chance)

Heat is the only factor that CAN degrade the maximum life span of a component. Where excessive heat is present, the maximum life span of surrounding componentry will suffer reductions to their maximum life spans until temperatures are reduced. This will push componentry closer to its chance to fail (chance roll) faster. Exhausted or failed componentry must be de-soldered, removed, installed and re-soldered.

Removing burnt compontry:

  • Boards as well as parts (sprites) retain data to define gold and silver connection points as soldering points.
  • Cursor is positioned over componentry for removal.
  • Left-Click hold at each gold point contact until a small sprite of grey pixels (smoke) emits, Stop. Over-exceeding the generous time limit will burn the board.
  • New part is loaded into soldering gun to represent what will be inserted with right-click.
  • Right-click to install the part that is loaded to the gun (Not loaded into; rather in a box to the side of a UI showing the gun and a small part cube.)
  • Left-click (short clicks) each grey or gold pin of the component to re-solder and reinstall the new component.
  • De-soldering junk componentry even if it hasn’t failed, discard board scrapping.

Builder Specifications and Reasons

The Board Builder is the program used to create many types of electrical circuits.

Tools:

  • Zoom (For board view window; Zooms into the board)
  • Board Viewer/Builder Window.
  • Lockable parts (For building; cannot be moved once locked)
  • Test build (For quick testing, checks pathways, polartitys with PASS or FAIL outcomes based on if pathways are complete, polaritys are correct and intercommuntcation between componentry is setup properly.) Displays approximate componentry lifespan as well.
  • Part Selector (for drag and drop of all componentry including all interconnects into the board viewer/builder window) Categorys
  • Additional Info (based on user reviews)
  • Place Imbedded Wire
  • Flip (+) (-) This flips the poles of the pins on any selected IN/OUT Jack

Example:

  • On vertical interconnects three pixels are flipped.
  • On horizontial interconnects a sprite flip will work.
  • Vertical interconnects sprites can still be flipped and rotated by 90* increments left or right. Pole flipping on verts pertains to three pixels.
  • Flipping is used to accommodate poles to chipsets and Integrated Circuits.
  • The parallel cables that are used for board to board connections automatically align poles (interconnection cables)

Example shown in “Placeable Wires” section:

Problems resolved; Mapping a Dual-Layer board :

  • A masking button for interpreting the lower dual-layer mapping from PTP to PTP.
  • With the masking tool when writing on the top board, it is actually written on the lower layer and mirrored by 2D perspective.

Example:

NOTE: The grey dots represent Pass-through-points.

The bottom Blue cursor mirrors the actual cursors movement when the (windows)cursor is within the board (effective when the masking/mirroring tool is used)

A button to toggle top boards display of componentry and Imbedded Wire (turns 60% transparent). Mainly we are only concerned with seeing the pass-through-points but being able to toggle this would aid in checking your pathways to various components from PTP to PTP.

Pin mapping, information/specifications window for Integrated Circuits and Chipsets.

This same window also shows any information for any other part.

Example:

Adjustable window panes
(Not shown) Scrolling down for more information.

Each IC and Chipset will vary from construction in :

  • Pin mapping
  • life span hardware requirements (Caps, Resistors and diodes)
  • CPU loads
  • Loads from multiple ICs Can be buffered with chipsets though they generally only absorb about (10%) of each connected ICs load. Buffer (IC load absorbtion) is extremely expensive.
    Before and during board finalization pathway reductions to speed(s) mentioned before are listed showing final speed(s), load rating(s) ect.

This all may be accomplished by already having a 3D plane thats size is determined by (pre-specified sizes based on 128px/64px/32px)

  • If in 2D (center top) view, parts are applied as described above.
  • If viewing on an angle the parts are dragged across the 3D surface as sprites (or as 3D objects)

Theory on board Finalization (2D to 3D Generation)

The theory of this topic is that once a board is ready to be finalized, it can be generated into a very thin plane (the board) and the parts (having pre-designated their amount of extrusion) raised slightly from the surface of that plane.

  • Imbedded wire, gold and grey contacts stay on the board surface and retain an ability to be de-soldered or re-soldered for repairs or scrapping. All parts are locked until they need to be replaced in which de-soldering is the unlocking/re-locking process.
  • Assuming the final board texture is run thru this texture stretcher I’ve heard You guys implemented in your previous titles.
  • Extruded voxels (basic shapes defined by their respective sprites)

Example:

  • A micro resistor is a small slightly raised rectangle on the board surface.
  • The rectangle is the size of the resistors pixels outlined.

Electrical Boards, Types and Sizes

Two main types of electrical base board :

  • Single Layer (Top layer only; cannot use pass-through-points)
  • Dual Layer (Uses of both layers of the board; Main componentry and interconnects must be located on the upper layer while capacitors, resistors, and diodes can be (optionally) located on the bottom layer to save space.

Three current classes:

  • Green
  • Blue (reduces reductive effects on speed from use of imbedded wire by some amount)
  • Blue and red boards are more difficult to do repairs on
  • Shorter soldering windows
  • Difficult to scrap
  • Slightly different solder for the three types
  • 5 sizes shown: 128x128px, 128x64px, 128x32px, 64x64px and 32x32px

Electrical Board Mapping Demo

Systems

Systems (integrated to ICs and or Chipsets) simply to have the ideas written.

Devices and Modules

  • Mining Enhancement Module (Example below)
  • Power systems (Devices to control important power systems power diverters or cloaking device/module)
    Card readers (example below), on-board and module based
  • Life support systems
  • Sheild systems
  • Navigation systems
  • Audio systems
  • Automated systems
  • Extraction Machinery
  • Micro fabricators (examples below): this is not a replicator but ither a controllable replacement part assembler or a system that uses one material as a base/foundation and depending on complexity, requires active introduction of a number of other materials to construct the part.

Micro Fabrication Examples:

Process:

  • Set what to fabricate; Supply base material. (light med-sm parts)
  • The virtual laser follows the cursor when the MF is active; the left mouse btn is clicked on the correct area of the base to active the MF.
  • Point cursor to correct area of the base material with 2nd material in hand.
  • Click on correct start area (light highlight); fabrication begins; Camera holds; arm movement.
  • With sweeping motionto next indicator and back, the part begins to form.
  • If step completes and part requires additional materials the last completed step becomes the new base. (paritially formed)

NOTE: The red LFO line does not need to be followed exactly for fabrication of quality parts (Ship parts)
If the fabricator (operator) executes very low deviation of the given “trace line” a special part is fabricated with durability boosts/other buffs As well as an inscription “Fabrication Masterpeice name” Not all processes will involve the above LFO line and may change from this to, for example a small oval, circle ect. when dealing with more complex fabrications.

  • Scanners (all-time)
  • Scanners (long range)
  • Destination setting (or course plotting)
  • Artifical Gravity
  • Auxilary Boosters
  • Speed Controllers (module)
  • Auto Pilot Device
  • Warp Drive systems
  • Pumps (coolant, water)
  • Sensors/Scanners
  • Weapons
  • Some Machines
  • Transmissions systems (radio/communication; frequency based)
  • Refreshment systems
  • Simple coffee machine (see below) based IC on a micro board comes standard. Runs the coffee machine for your christening sip.
  • Some various on-ship equipment does not require any connection to the DCPU or main CPU. e.g. A coffee maker only requires power and a switch, once power is supplied it runs independently.

Integration to the Ship

Across the ship, DCPU connections to power strips (communication strips) are automatically routed to the DCPU. Connections (for devices and modules) are made from the main panel, to the DCPU
CPU boards are fitted under panels, and each ship can only carry one. Larger ships with more equipment require better CPU boards (Main processor board) and only require in and out connections from the panel to the ships hull.

  • Power strips/comm strips have CPU input outputs for each case or a grid is allowed near racking to place Input, output, power DCPU and CPU load jacks.
  • CPU load connections only require in and out connections under the main panel.
  • Other Blue ports around the ship all automatically route back to the CPU. (main processor)e.g. The two panel CPU connections automatically branch out to all other BLUE jacks around the ship.
  • Same with DCPU to the rest of the ship, though panels have DCPU plugs on the DCPU housing for the connection of devices and modules located to the left or right of the DCPU. Connections across the ship (U Strips, ect.) are automatic.
  • Main panels can vary in size and shape but all have device and module limits and all open up some in way.
  • Only GRAY inputs and outputs are assigned to each other across the ship manually by names, numbers or some sort of mapping HUD.

Panel front opened

Gray I/Os are assigned manually from the Panel to Comm Strips

Fully opened:

Example of a larger panel:

Electronics Room and Racking Example:

Example of Case skin with cutouts for wires and ports on the board level:

Case shows some mocup expansion ports (4) with covers (3), power switch (1), activity lights (2), diagnostics ports (2), fan expansion (1), Case Temp. Display (1) rear opening for I/Os/Interconnects, upper openings for placeable wire connections and preforated side and rear sections that can be removed if a board has side interconnects. The rear removeable section is for further board access/interconnection.

These cases slide out on a specific racking design so there is no Interference with connected wiring when sliding the case in and out. Front panel of case : Expansion ports, activity lights, power switch, diagnostics ports and temperature display all require connection to the enclosed board.

Power

The ” U ” is the power/communications strip, connections from it to the main panel are automatic for BLUE and BROWN jacks. RED and BLACK power mains across the ship are all supplied by the central energy generation system, what ever it may be.

Devices (Device List)

Sensors (Sensor List)

Coming Soon.

Racks and board covers

Fastening (screws)

 

Wifi Demo

More Coming Soon…!

Please let me know your thoughts below in the comments and if you have any suggestions. What do you think of this idea? What would you add/change to make it better? Looking forward to your responses…

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